零件/ XPD-200系列

Backside-Illuminated Photodiode Array in Chip-Scale Package

XPD-200 Series_Backside-Illuminated Photodiode Array in Chip-Scale Package

The XPDA-200 photodiode series offers high sensitivity, high-speed, and low-cost silicon photodiodes for industrial and consumer applications. Its modular design enables monolithic 1D and 2D arrays for applications including triangulation, spot tracking, angle measurement, and rotary encoders. Custom configurations are available, with arrays of up to 15 x 15 individually accessible pixels.

High quantum efficiency in the NIR with the backside-illuminated structure. Very small footprint with chip-scale package. Tileable design for monolithic 2D photodiode arrays.

Photo-光敏面积1 x 1 mm² elements
量子效率90% at 850 nm
噪声电流4 fW/√Hz
上升/下降时间90 ns at 10 V reverse bias

Photo-光敏面积1 x 1 mm² elements
量子效率90% at 850 nm
噪声电流4 fW/√Hz
上升/下降时间90 ns at 10 V reverse bias

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