Backside-illuminated Photodiode in Chip-Scale Package
Designed for compact optical sensing applications, Excelitas backside-illuminated photodiodes combine high near-infrared sensitivity and fast response times with surface-mountable chip-scale packaging, supporting the growing demand for miniaturization in industrial and consumer systems.
Backside-Illuminated Photodiode in Chip-Scale Package
The XPD-100-1 is a high-sensitivity, high-speed, low-cost silicon photodiode designed for industrial and consumer applications. Its advanced chip-scale package (CSP) makes it ideal for miniaturized systems where space is limited. Typical applications include light barriers, smoke detectors,...
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Backside-Illuminated Photodiode Array in Chip-Scale Package
The XPDA-200 photodiode series offers high sensitivity, high-speed, and low-cost silicon photodiodes for industrial and consumer applications. Its modular design enables monolithic 1D and 2D arrays for applications including triangulation, spot tracking, angle measurement, and rotary encoders....
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