零件/ XPD-100-1

Backside-Illuminated Photodiode in Chip-Scale Package

XPD-100-1_Backside-Illuminated Photodiode in Chip-Scale Package

The XPD-100-1 is a high-sensitivity, high-speed, low-cost silicon photodiode designed for industrial and consumer applications. Its advanced chip-scale package (CSP) makes it ideal for miniaturized systems where space is limited. Typical applications include light barriers, smoke detectors, proximity sensors, light curtains, liquid and level detectors, heartbeat monitors, oximeters, linear and rotary position detection, angle detection, and infrared (IR) remote control.

High quantum efficiency in the NIR due to its backside-illuminated structure. Very small footprint with a chip-scale package.

Photo-光敏面积1.65 x 1.65 mm²
量子效率90% at 850 nm
噪声电流12 fW/√Hz
上升/下降时间70 ns at 10 V reverse bias

Photo-光敏面积1.65 x 1.65 mm²
量子效率90% at 850 nm
噪声电流12 fW/√Hz
上升/下降时间70 ns at 10 V reverse bias

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